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TO-126

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Front and back of a transistor in a TO-126 package.

TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. On one side of the package typically a metal sheet is exposed, with the transistor die bonded to the other side of the metal sheet inside the package. This allows for an efficient heat transfer from the transistor die to an external heat sink but also implies that the metal sheet is electrically connected to the die (for a bipolar junction transistor usually the collector is connected to this metal sheet).

History and origin

The JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.

STMicroelectronics refers to this package style as SOT-32.

National Standards

Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3
Standards organization Standard Designation for TO-126
JEDEC JEP95 TO-225AA
IEC IEC 60191 A56
DIN DIN 41869 12A3
Gosstandart GOST 18472—88 KT-27
Rosstandart GOST R 57439—2017
Kombinat Mikroelektronik Erfurt TGL 11811 N
TGL 26713/09 H1B
  1. Russian: КТ-27

See also

  • TO-66, a metal package with similar power ratings
  • TO-220, a plastic package with higher power ratings

References

  1. BD135; BD137; BD139; NPN power transistors (PDF), Philips Semiconductors, 1999, retrieved 2013-12-09
  2. ^ Bill Roehr (2001), AN1040/D: Mounting Considerations For Power Semiconductors (PDF), On Semiconductor, retrieved 2014-01-25
  3. "JEDEC TO-126 package specification" (PDF). JEDEC. May 1968. Archived from the original (PDF) on June 18, 2017.
  4. MJE340 MJE350 Complementary silicon power transistors (PDF), STMicroelectronics
  5. "TO-225" (PDF). JEDEC. Archived from the original (PDF) on 2016-04-10. Retrieved 2021-06-21.
  6. ^ "TGL 26713/09: Gehäuse für Halbleiterbauelemente - Bauform H" [Outline drawings for semiconductor devices; Type H] (PDF) (in German). Leipzig: Verlag für Standardisierung. June 1988. Retrieved 2021-06-15.
  7. "NPN Silicon Transistors BD135 BD137 BD139" (PDF). Siemens. Retrieved 2021-08-20.
  8. "ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры" [GOST 18472—88 Semiconductor devices - basic dimensions] (PDF) (in Russian). Rosstandart. 1988. p. 56. Retrieved 2021-06-17.
  9. "ГОСТ Р 57439—2017 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры" [GOST R 57439—2017 Semiconductor devices - basic dimensions] (PDF) (in Russian). Gosstandart. 2017. p. 70-71. Retrieved 2021-06-17.

External links

Semiconductor packages
Single diode
  • DO-201 (DO-27)
  • DO-204 (DO-7 / DO-26 / DO-35 / DO-41)
  • DO-213 (MELF / SOD-80 / LL34)
  • DO-214 (SMA / SMB / SMC)
  • SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin
Single row
Dual row
Quad row
Grid array
Wafer
Related topics
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.


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